Importance

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Abstract

Structure and method for securing a molding compound to a leadframe paddle is disclosed. Half-holes are etched in the top surface of the leadframe paddle. Moreover, each side of the leadframe paddle is provided with a respective anchor. A die is then attached to the top surface of the leadframe paddle. During the molding process, the molding compound covers the die, the anchors, and fills the half-holes in the top surface of the leadframe paddle. The half-holes cause the molding compound to be locked into the paddle. The half-holes also increase the interface surface area between the molding compound and the top surface of the leadframe paddle. Moreover, during the molding process, the molding compound will encapsulate the anchors provided on each side of the die. When the molding compound hardens around the anchors, the molding compound is reinforced and held in place by the anchors. In essence, the anchors act as supports that extend in four directions within the molding compound to hinder both upward and downward movement of the molding compound. Accordingly, the half-holes and anchors result in a better adhesion of the molding compound to the top surface of the leadframe paddle.

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First Claim