Importance

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Abstract

A method of fabricating a micro-electromechanical systems (MEMS) device that is positioned on a wafer substrate that incorporates drive circuitry includes depositing a first sacrificial layer of an organic material on the wafer substrate. The first sacrificial layer is patterned. A first layer of conductive material is deposited on the first sacrificial layer. The first layer of conductive material is patterned. A second sacrificial layer of organic material is deposited on the first layer of conductive material. The second sacrificial layer is patterned. A second layer of conductive material is deposited on the second sacrificial layer. The second layer of conductive material patterned. A third sacrificial layer of organic material is deposited on the second layer of conductive material. The third sacrificial layer is patterned. A structural layer of dielectric material is deposited on the third sacrificial layer. The structural layer is patterned. The sacrificial layers are removed to release MEMS structures defined by the first and second layers of conductive material.

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First Claim