Capacitance type dynamic quantity sensor having displacement portion and formed by wire bonding
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United States of America Patent
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-
Jan 7, 2003
Grant Date -
Jan 3, 2002
app pub date -
Jun 15, 2001
filing date -
Jun 26, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
In a capacitance type dynamic quantity sensor, a movable electrode is connected to a support substrate through a frame shaped displacement portion. The displacement portion is composed of first and second beams and a beam connection part connecting the first and second beams at ends thereof. The support substrate has electrode pads for wire bonding involving vibration. The first and second beams can perform flexural vibration at a natural frequency with the beam connection part working as a free end. The shape of the beam connection part is adjusted so that the natural frequency at the flexural vibration is different from that of the vibration applied by the wire bonding.
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