Ink jet semiconductor chip structure
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United States of America Patent
Stats
-
Jan 7, 2003
Grant Date -
Aug 1, 2002
app pub date -
Jan 30, 2001
filing date -
Jan 30, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a printhead body having a chip surface side, an ink surface side opposite the chip surface side and a first coefficient of thermal expansion (CTE). A semiconductor chip containing ink ejector devices is adhesively attached to the chip surface side of the printhead body. A stiffener is adhesively attached to the ink surface side to provide body stiffening during curing of the adhesive. The semiconductor chip has a second CTE and the stiffener has a third CTE wherein the second and third CTE's have a similar value. The invention provides an improved structure for printheads which resist warpage and/or breakage of the semiconductor chips during the manufacturing process used to make the printheads.
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