Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array
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United States of America Patent
Stats
-
Jan 7, 2003
Grant Date -
Sep 12, 2002
app pub date -
Apr 30, 2001
filing date -
Dec 10, 1997
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.
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