Importance

Loading Importance Indicators...

Abstract

There is provided a semiconductor device having a semiconductor chip in which a first protrusion electrode is formed on the semiconductor substrate; and an intermediate substrate which comprises a base substrate, a first external terminal provided in said base substrate, which is joined to said first protrusion electrode, a second external terminal provided in said base substrate, an electrode section being exposed on both surfaces of said base substrate, and a second protrusion electrode formed at one end face of said second external terminal, a plurality of said intermediate substrates being stacked in layers by joining said second protrusion electrode to the other end face of said second external terminal, thus enabling miniaturizing and lightening electronic equipment and realizing high reliability and high performance.

Loading the Abstract Image...

First Claim