Electronic assembly having a wetting layer on a thermally conductive heat spreader
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United States of America Patent
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Jan 7, 2003
Grant Date -
N/A
app pub date -
Nov 15, 2001
filing date -
Nov 15, 2001
priority date (Note) -
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Abstract
An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.
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