Field emitting device comprising metallized nanostructures and method for making the same
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United States of America Patent
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Jan 7, 2003
Grant Date -
N/A
app pub date -
Jul 30, 1999
filing date -
Jul 15, 1999
priority date (Note) -
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Abstract
In accordance with the invention, an improved conductive nanostructure assembly comprises an array of metallized nanostructures disposed on a conductive substrate. The substrate can also be metallized. Such assemblies provide continuous electron transport from the substrate to the tips of the nanostructures. Several ways of making such assemblies are described along with several devices employing the assemblies.
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