Method for removing photoresist layer on wafer edge
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United States of America Patent
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-
Jan 14, 2003
Grant Date -
Jul 25, 2002
app pub date -
Jan 24, 2001
filing date -
Jan 24, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for removing a photoresist layer on wafer edge is disclosed. The invention uses a light source located under a spin on coated wafer mounted on a supporting mean of a rotatable chuck to expose the photoresist material on the wafer edge. First of all, the spin on coated wafer is mounted on the supporting mean of the rotatable chuck. Then the rotatable chuck is rotated and the wafer is exposed to the light source. Finally, the wafer is developed.
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