Power semiconductor module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 14, 2003
Grant Date -
N/A
app pub date -
Sep 7, 2000
filing date -
Sep 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a power semiconductor module (10) having a baseplate (1) on which at least one substrate (13) is arranged which is fitted with power semiconductor chips (11, 12) and can be pressed via pressure elements and contact cords (17) against the baseplate (1). The baseplate (1) has centering elements on which a frame (3) which defines fields (7) and is in the form of a grid is provided, with corresponding substrates (13) with power semiconductor chips being arranged in at least some of the fields (7), which substrates (13) can be made contact with via contact rails (15).
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