Contact probe pin for wafer probing apparatus
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United States of America Patent
Stats
-
Jan 14, 2003
Grant Date -
Aug 22, 2002
app pub date -
Feb 20, 2001
filing date -
Feb 20, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved contact probe pin for wafer probing apparatus including an elongated metal conductor having a connector (or proximal) end, a center or medial section coated with an elastic material, and a contact pad engaging tip end. At least a portion of the center section of the probe pin is coated with a poorly conductive, but highly elastic material so as to enhance its flex characteristics. The coating may uniformly cover a portion of the center section of the probe pin or it may take on a predetermined pattern or shape. The coating may also unevenly cover a portion of the center section of the probe pin. The coating is selected such that it augments or enhances the resiliency of the pin and causes it to have a predetermined stress-strain profile with vertical (or Z-axis) displacement, and thus enables it to have predetermined probe pin tip contact force characteristics.
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