Integrated circuit package separators
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 21, 2003
Issued Date -
N/A
app pub date -
Oct 12, 2000
filing date -
Oct 20, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.
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