Method of mounting fluid ejection device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 21, 2003
Issued Date -
N/A
app pub date -
Mar 8, 2000
filing date -
Oct 28, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of mounting a fluid ejection device having a first plurality of pads on a carrier substrate having a corresponding second plurality of pads includes positioning the first plurality of pads with respect to the second plurality of pads, and melting solder between the first plurality of pads and the second plurality of pads. Melting the solder includes aligning the first plurality of pads with respect to the second plurality of pads with a solder reflow force and forming a fluidic boundary between the fluid ejection device and the carrier substrate with the solder.
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