Method for manufacturing ink jet recording head, ink jet recording head, and ink jet recording apparatus
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United States of America Patent
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Jan 21, 2003
Grant Date -
N/A
app pub date -
Jun 8, 2000
filing date -
Jun 9, 1999
priority date (Note) -
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Abstract
The present invention relates to a method for manufacturing an ink jet recording head using wet etching, the method providing a high production efficiency, an ink jet recording head manufactured by this method, and an ink jet recording apparatus using this recording head. A silicon substrate, constituting a recording head, has functional elements formed thereon and including heat-generating resister elements and a drive circuit therefor, a protective layer is formed on the silicon substrate for protecting the functional elements from an etchant that is in contact with a substrate surface via an adhesive layer, and an ink supply port is formed by means of wet etching. The adhesive layer allows the protective layer to adhere well to the substrate to appropriately prevent the functional elements from being damaged by the etchant.
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