Elimination of pad glazing for Al CMP
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United States of America Patent
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-
Jan 21, 2003
Grant Date -
Oct 18, 2001
app pub date -
Oct 19, 1999
filing date -
Oct 19, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Polishing pad glazing during CMP of Al and Al alloys is eliminated or substantially reduced by utilizing a neutral polishing slurry containing a sufficient amount of a surfactant to prevent agglomeration of the abrasive particles with polishing by-products. Embodiments include CMP an Al or an Al alloy surface employing a slurry containing abrasive Al.sub.2 0.sub.3 particles and about 0.02 to about 5 wt. % of a surfactant to prevent Al.sub.2 0.sub.3 abrasive slurry particles from agglomerating with Al(OH).sub.3 polishing by-products. Embodiments further include subsequent ex situ pad conditioning using an acid or base to dissolve, or a complexing agent to remove, Al(OH).sub.3 polishing by-products.
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