US Patent No: 6,510,038

Number of patents in Portfolio can not be more than 2000

High-voltage feedthrough capacitor

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Importance

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Abstract

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In a high-voltage feedthrough capacitor, a grounding member has two through-holes spaced away from each other. Feedthrough capacitors each has one central conductor, a dielectric layer, and an electrode. The periphery of the central conductor is respectively covered with the dielectric layer, and the surface of the dielectric layer is respectively covered with the electrode. The feedthrough capacitor extends respectively through the through-hole, and has been fitted to the grounding member. The electrode has been bonded to the grounding member. An armoring insulator covers the peripheries of the feedthrough capacitors and the periphery of the grounding member.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TDK CORPORATIONTOKYO, JP3929

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Isao Anjo, JP 49 243
Sasaki, Setsuo Yuri-gun, JP 16 132
Satou, Tukasa Akita, JP 1 49

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TDK CORPORATION (6)
* 4,768,129 Through type twin capacitor 7 1987
* 4,811,161 Through-type capacitor and magnetron using same 16 1987
* 5,032,949 High-voltage through-type ceramic capacitor 10 1989
* 5,113,309 High-voltage through-type ceramic capacitor 5 1991
* 5,544,002 High voltage capacitor and magnetron 56 1994
* 5,729,425 High voltage capacitor and magnetron having porcelain dielectric material 6 1996
 
MURATA MANUFACTURING CO., LTD. (1)
* 5,040,091 Feed-through capacitor 11 1990
 
DAEWOO ELECTRONICS CO., LTD. (1)
* 5,600,531 Capacitor for magnetron of microwave oven 4 1994
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Schurter AG (1)
* 7,744,419 Appliance connector device with integrated filter module 0 2008
 
SOUTHWEST RESEARCH INSTITUTE (2)
* 8,310,243 Local electrochemical impedance spectroscopy (LEIS) for detecting coating defects in buried pipelines 0 2010
* 2012/0038,376 Local Electrochemical Impedance Spectroscopy (LEIS) for Detecting Coating Defects in Buried Pipelines 0 2010
 
GREATBATCH LTD. (1)
7,551,963 Apparatus to improve the high voltage flashover characteristics of EMI feedthrough filters used in active implantable medical devices 0 2005
 
MAPPER LITHOGRAPHY IP B.V. (2)
* 8,624,478 High voltage shielding arrangement of a charged particle lithography system 0 2010
* 2011/0084,592 HIGH VOLTAGE SHIELDING ARRANGEMENT 0 2010
 
X2Y ATTENUATORS, LLC (43)
7,262,949 Electrode arrangement for circuit energy conditioning 29 2001
7,433,168 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node 9 2001
7,193,831 Energy pathway arrangement 34 2001
7,274,549 Energy pathway arrangements for energy conditioning 30 2001
7,336,468 Arrangement for energy conditioning 20 2002
7,110,235 Arrangement for energy conditioning 34 2002
7,106,570 Pathway arrangement 35 2002
7,110,227 Universial energy conditioning interposer with circuit architecture 40 2002
* 7,042,703 Energy conditioning structure 35 2003
7,423,860 Multi-functional energy conditioner 25 2003
7,113,383 PREDETERMINED SYMMETRICALLY BALANCED AMALGAM WITH COMPLEMENTARY PAIRED PORTIONS COMPRISING SHIELDING ELECTRODES AND SHIELDED ELECTRODES AND OTHER PREDETERMINED ELEMENT PORTIONS FOR SYMMETRICALLY BALANCED AND COMPLEMENTARY ENERGY PORTION CONDITIONING 34 2003
7,141,899 Component carrier 37 2003
7,180,718 Shielded energy conditioner 34 2004
7,440,252 Connector related structures including an energy conditioner 18 2004
6,954,346 Filter assembly 44 2004
7,675,729 Internally shielded energy conditioner 25 2004
7,443,647 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package 21 2005
7,224,564 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node 30 2005
7,427,816 Component carrier 0 2005
7,301,748 Universal energy conditioning interposer with circuit architecture 32 2005
7,321,485 Arrangement for energy conditioning 21 2005
7,817,397 Energy conditioner with tied through electrodes 9 2006
7,782,587 Internally overlapped conditioners 10 2006
7,630,188 Conditioner with coplanar conductors 10 2006
7,586,728 Conditioner with coplanar conductors 14 2006
7,428,134 Energy pathway arrangements for energy conditioning 18 2006
8,026,777 Energy conditioner structures 3 2007
7,609,500 Universal energy conditioning interposer with circuit architecture 11 2007
7,609,501 Manufacture including shield structure 12 2008
7,688,565 Arrangements for energy conditioning 10 2008
7,593,208 Multi-functional energy conditioner 16 2008
7,768,763 Arrangement for energy conditioning 9 2009
7,733,621 Energy conditioning circuit arrangement for integrated circuit 14 2009
7,920,367 Method for making arrangement for energy conditioning 5 2010
8,004,812 Energy conditioning circuit arrangement for integrated circuit 3 2010
7,916,444 Arrangement for energy conditioning 5 2010
7,974,062 Internally overlapped conditioners 3 2010
8,014,119 Energy conditioner with tied through electrodes 3 2011
8,018,706 Arrangement for energy conditioning 3 2011
8,023,241 Arrangement for energy conditioning 4 2011
8,547,677 Method for making internally overlapped conditioners 1 2011
8,587,915 Arrangement for energy conditioning 1 2011
9,001,486 Internally overlapped conditioners 0 2013
 
LG ELECTRONICS INC. (1)
7,365,291 High voltage input apparatus for magnetron 0 2004
 
SOUTHERN WATER SERVICES LIMITED (1)
7,336,467 Energy pathway arrangement 20 2001
* Cited By Examiner