Method and apparatus using laminated foils for placing conductive preforms
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United States of America Patent
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Jan 28, 2003
Issued Date -
N/A
app pub date -
Oct 2, 2000
filing date -
Jan 28, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A method and apparatus are disclosed for placing solder balls 320 on electronic pads 910 or 1010 on a component 900 or substrate 1000, such as for a ball grid array (BGA) applicator 100. The solder balls 320 are held to openings 202 in a foil 130 against a second layer 350 by a holding force, whereby the second layer is of a porous material and laminated to the foil 130. One such holding force can be a vacuum force 222 applied to the solder balls 320 through the openings 202 in a foil 130. After locating the solder balls 320 at electronic pads 910 or 1010 on a component 900 or substrate 1000, by removing the holding force 222, the solder balls 320 are released and placed on the electronic pads 910, 1010. Optionally, a plurality of pins may provide a releasing and/or placing force.
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