Hybrid organic-inorganic planar optical waveguide device
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United States of America Patent
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Jan 28, 2003
Grant Date -
N/A
app pub date -
Aug 8, 2000
filing date -
Dec 13, 1996
priority date (Note) -
Expired
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Abstract
A planar optical device is formed on a substrate. The device comprises an array of waveguide cores which guide optical radiation. A cladding layer is formed contiguously with the array of waveguide cores to confine the optical radiation to the array of waveguide cores. At least one of the array of waveguide cores and cladding layer is an inorganic-organic hybrid material that comprises an extended matrix containing silicon and oxygen atoms with at least a fraction of the silicon atoms being directly bonded to substituted or unsubstituted hydrocarbon moieties. This material can be designed with an index of refraction between 1.4 and 1.55 and can be deposited rapidly to thicknesses of up to 40 microns. In accordance with another embodiment of the invention, a method for forming a planar optical device obviates the need for a lithographic process. Illustratively, a method for forming an array of cores comprises the steps of: (1) preparing a waveguide core composition precursor material comprising at least one silane and a source of hydrocarbon moiety, (2) partially hydrolyzing and polymerizing the waveguide core precursor material to form a waveguide core composition, (3) using a mold, forming an array of waveguide cores comprising the waveguide core composition, and (4) completing hydrolysis and polymerization of the waveguide core composition under conditions effective to form an inorganic-organic hybrid material that comprises an extended matrix containing silicon and oxygen atoms with at least a fraction of the silicon atoms being directly bonded to substituted or unsubstituted hydrocarbon moieties. A cladding layer is then deposited over the array of waveguide cores. The use of the mold to pattern the array of waveguide cores obviates the need for a lithographic process.
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Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| CORNING INCORPORATED | HOUGHTON PARK CORNING NEW YORK UNITED STATES OF AMERICA |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Dawes, Steven B | Corning, NY | 39 | 730 |
| Johnson, Ronald E | Tioga, PA | 62 | 1420 |
| Maschmeyer, Richard O | Corning, NY | 11 | 269 |
| Shoup, Robert D | Seabrook Island, SC | 15 | 382 |
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| Fee | Large entity fee | small entity fee | micro entity fee |
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| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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