Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly
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United States of America Patent
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-
Jan 28, 2003
Issued Date -
N/A
app pub date -
May 24, 2001
filing date -
Sep 20, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes a conductive trace. A ball bond contacts and electrically connects the conductive trace and the pad. A method of manufacturing the assembly includes mechanically attaching the chip to the support circuit and then forming the ball bond using thermocompression or thermosonic wire bonding.
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