Circuit board semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 28, 2003
Grant Date -
N/A
app pub date -
Jun 7, 2000
filing date -
Jun 7, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A circuit board for semiconductor packages capable of fabricating a large number of semiconductor packages in a single circuit board, the circuit board including: a resin layer in the form of a rectangular sheet with first and second sides, the resin layer having a plurality of through holes arranged in rows and columns sharing a sub slot of a predetermined length as a common boundary to form one sub strip for mounting a semiconductor chip, a plurality of the sub strips being arranged in a row and sharing a main slot of a predetermined length as a common boundary to form one main strip; a plurality of circuit patterns each formed in the resin layer between the through hole of the individual sub strip and the sub slot; and a cover coat coated on the resin layer for the purpose of protecting the circuit patterns against external environments.
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