Method and apparatus using a semiconductor die integrated antenna structure
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United States of America Patent
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Jan 28, 2003
Grant Date -
N/A
app pub date -
Mar 20, 2001
filing date -
Mar 20, 2001
priority date (Note) -
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Abstract
A communication device (50) operating at a plurality of frequencies has a processor (36) coupled to a semiconductor die integrated antenna structure (30) having a first integrated antenna (14) tuned to a first frequency and coupled to a first circuit (17) and at least a second integrated antenna (18) tuned to a second frequency and coupled to a second circuit (21). The processor controls either the first circuit or the second circuit or both.
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