Nozzle for cleaving substrates
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United States of America Patent
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Feb 4, 2003
Grant Date -
Feb 28, 2002
app pub date -
Mar 14, 2001
filing date -
Aug 10, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.
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