Importance

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Abstract

The present invention is directed to a wafer clamping mechanism responsive to fluid pressure to retain wafers on a surface with minimal clamping force. The clamping mechanism houses simple operative elements within a housing proximate the wafer and can utilize existing fluid pressure sources to energize the clamping mechanism. In a first embodiment, the clamping mechanism includes a piston and cylinder to urge a clamping arm against the wafer in response to fluid pressure. In a second embodiment, the clamping mechanism includes a bellows arrangement for urging the clamping finger against the wafer in response to a fluid pressure source. In a third embodiment, the clamping mechanism includes a bladder arrangement wherein a bladder is expanded using fluid pressure to urge the clamping arm against the wafer in response to a fluid pressure source. In a fourth embodiment, the clamping mechanism includes a flexure member attached to a dual bellows arrangement for urging the flexure member against the wafer in response to a vacuum pressure source. In a fifth embodiment, the clamping mechanism includes a bent flexure member attached to a dual bellows arrangement with an internal piston and cylinder for urging the flexure member against the wafer in response to positive pressure source.

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First Claim