Resist processing method and resist processing apparatus
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United States of America Patent
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Feb 4, 2003
Issued Date -
N/A
app pub date -
Sep 22, 2000
filing date -
May 20, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resist processing method includes (a), to a substrate having a circuit pattern with an uneven surface formed thereon, coating a photoresist solution to, by doing so, form a photoresist film, (b) subjecting the substrate to heat processing to cause a portion of the photoresist film to be chemically modified to create a modified resist layer of a substantially uniform thickness from the uneven surface of the circuit pattern, and (c) selectively removing only a resist portion unmodified at the step (b) to leave a modified resist layer on the uneven surface of the circuit pattern.
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