Solution processing apparatus and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 4, 2003
Grant Date -
N/A
app pub date -
Oct 3, 2000
filing date -
Oct 5, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solution separation ring made of a material with adhesion to a processing solution stronger than that of a rear face of a wafer is provided to surround the periphery of a substrate horizontally held by a spin chuck with a slight clearance therebetween. A supply nozzle is moved from one end side to the other end side of the substrate while supplying the processing solution, and discharge ports of the supply nozzle are allowed to get closer to a summit portion of the solution separation ring near the other end side of the substrate. At this time, the processing solutions on the discharge ports and the front face of the substrate which are contiguous with each other by surface tension are separated caused so as to flow toward the solution separation ring side, thereby preventing an excessive processing solution from returning onto the front face of the substrate.
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