Method of producing flex circuit with selectively plated gold
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United States of America Patent
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-
Feb 4, 2003
Grant Date -
N/A
app pub date -
Jun 30, 2000
filing date -
Jun 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semiconductor chips. This method eliminates the requirement to buss all circuits to a common plating contact by using a background seed metal for plating continuity. This method also provides a means to alleviate the requirement for precise registration or alignment when multiple photoresist layers are employed in order to selectively plate only a portion of the metallic elements present on the flexible circuit board. The defect of resist lifting followed by nickel/gold underplating is eliminated by conditioning the intermediate photoresist to survive the nickel/gold plating bath.
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