Silicon wafer probe station using back-side imaging
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United States of America Patent
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Feb 4, 2003
Grant Date -
N/A
app pub date -
Jul 17, 2000
filing date -
Jul 17, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A back-side imaging infrared microscope is integrated with a novel integrated-circuit probe station. The microscope is located below the silicon substrate of the integrated circuit, on the side opposite to the probe card. The electronic circuitry located on the top side of the substrate is imaged through the back side of the substrate and through a window sized to provide a view of a single integrated circuit and of the corresponding probe tips overlying the contact pads. Since the silicon substrate of integrated circuits is transparent to infrared wavelengths, the alignment between probe tips and contact pads is carried out with a clear view of both from the bottom of the substrate. Furthermore, emission images from the integrated circuit are taken during testing with the same microscope after electrical contact has been established.
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