High speed pressure mount connector
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United States of America Patent
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-
Feb 11, 2003
Issued Date -
N/A
app pub date -
Jun 11, 2001
filing date -
Feb 3, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A high speed, high density electrical connector for use with printed circuit boards is described. The connector is manufactured with wafer assemblies that are supported by a stiffener. Each wafer includes two pieces; a first piece supports both signal and ground conductors and a second piece supports signal conductors. The disclosed embodiments are principally configured for carrying differential signals, though other configurations are discussed. For differential signals, the signal conductors are arranged in pairs. The two pieces are attached together such that the signal pairs are formed with the broadside of, the conductors disposed adjacent. The connector attaches to at least one circuit board using pressure mounted contacts.
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