Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
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United States of America Patent
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Feb 11, 2003
Grant Date -
N/A
app pub date -
Mar 10, 2000
filing date -
Mar 10, 2000
priority date (Note) -
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Abstract
A method and apparatus for improving the pad conditioning process of a polishing pad in a chemical-mechanical polishing apparatus employs closed loop control of the polishing pad conditioning process. An arrangement includes a pad conditioning head carried by an arm that is coupled to an arm support located remotely from the conditioning head. A down force sensor in the arm support measures the down force exerted by the pad conditioning head through the conditioning disk. A controller receives the down force measurements from the down force sensor and controls the arm support to controllably vary the down force exerted by the pad conditioning head. The conditioning apparatus is thus controlled in response to the feedback from the down force measurements in a closed loop control to modify the conditioning process and control the pad wear uniformity.
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