Importance

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Abstract

A conditioning element for trueing and dressing a polishing pad used in a chemical mechanical polishing process (CMP) in connection with the manufacture of semi-conductors is provided with a relatively thin protective coating comprising a material resistant to corrosive attack by CMP slurry compositions, including those particularly well-suited to resist the harsher highly acidic slurry compositions. The CMP conditioning disk comprises a substrate having a surface carrying a monolayer of superabrasive particles braze bonded to the disk and a relatively thin liquid impermeable protective coating which is applied over the surface of the braze bond material and abrasive particles. For use in highly corrosive slurry compositions such as ferric nitrate, CMP braze bonded disk carrying coatings applied by vapor deposition methods comprising chromium and multilayered coatings comprising layers of chromium and amorphous diamond or chromium nitride, for example, are particularly effective to preserve the bond strength of the braze bond material holding the abrasive particles on the CMP conditioning disks.

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First Claim