Method for reducing particle contamination during the wet processing of semiconductor substrates
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United States of America Patent
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Feb 11, 2003
Grant Date -
N/A
app pub date -
Jan 5, 2000
filing date -
Jan 5, 1999
priority date (Note) -
Expired
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Abstract
The present invention provides methods of reducing particle contamination during wet processing of semiconductor substrates. In one embodiment of the present invention, a surfactant is added to any processing solution having a gas-liquid interface that the semiconductor substrates will be contacted with during immersion. The surfactant reduces the contact angle of the processing solution to less than 90.degree. and inhibits deposition of particles onto the semiconductor substrates during immersion. In a preferred embodiment of the present invention, the semiconductor substrates are contacted with only one gas-liquid interface during wet processing that occurs during the immersion of the semiconductor substrates in an initial liquid processing solution. In this embodiment, the last processing solution in contact with the semiconductor substrates is removed by displacement with a drying fluid stream.
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