High density composite material
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United States of America Patent
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Feb 11, 2003
Grant Date -
N/A
app pub date -
Dec 3, 1999
filing date -
Jun 28, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.
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