Substrate temperature control system and method for controlling temperature of substrate

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United States of America Patent

PATENT NO 6518548
SERIAL NO

10084378

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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So as to provide a substrate temperature control system capable of unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temperature control plate (heating or cooling plate) having a plurality of projections on the surface and serving to set the temperature of the substrate, and a chuck mechanism to fix the substrate in contact to a plurality of the projections by chucking the substrate toward the direction of the temperature control plate.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirasawa, Shigeki Ishioka, JP 35 1355
Kaneko, Yutaka Hachioji, JP 138 1749
Kanetomo, Masafumi Suginami-ku, JP 16 1082
Kuroda, Katsuhiro Hachioji, JP 48 1715
Murai, Fumio Nishitama-gun, JP 38 942
Sugaya, Masakazu Kawasaki, JP 30 648
Watanabe, Tomoji Tsuchiura, JP 10 522
Yamamoto, Tatuharu Higashimurayama, JP 4 475

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