Method of assembling a semiconductor chip package
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United States of America Patent
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Feb 11, 2003
Grant Date -
N/A
app pub date -
Nov 15, 2000
filing date -
Dec 13, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.
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