Microsensor having a sensor device connected to an integrated circuit by a solder joint
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 18, 2003
Grant Date -
N/A
app pub date -
Jun 2, 2000
filing date -
Jun 2, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully