Packaging for planiform objects/products
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United States of America Patent
Stats
-
Feb 18, 2003
Grant Date -
N/A
app pub date -
Aug 17, 2001
filing date -
Dec 9, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention relates to a packaging for planiform objects/products such as susceptors, wafers, chewing gum, TTS, TDDS, TDS, stamps, microchips or like. Said packaging consists of a support card (1) with one or more cavities (2) for receiving the object(s). The upper side of said support card is covered by a cover film (3) which occludes the cavities and which is sealed with th support card at sealing lines (4) at least in the marginal area around the cavities in such a manner that sad film can be torn open. Said sealing lines are surrounded by a weakened line (c) the cover film which merges into the contour of a tab (3a) for grasping and manually tearing open the cover film above the respective cavity.
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Family
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