Diffusion bonding of gaps
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United States of America Patent
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Feb 18, 2003
Issued Date -
N/A
app pub date -
Sep 6, 2001
filing date -
Sep 6, 2001
priority date (Note) -
Expired
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Abstract
A process for diffusion bonding of cracks and other gaps in high-temperature nickel and cobalt alloy components is described. The gap is filled with alloy powder matching the substrate alloy, or with an alloy of superior properties, such as MAR-M 247, MAR-M 247LC, or CM 247LC. A braze containing a melting point depressant is either mixed into the alloy powder or applied over it. The depressant is preferably hafnium, zirconium, or low boron. The component is heated for 15-45 minutes above the melting point of the braze, which fills the spaces between the alloy powder particles. The component is diffused at a temperature above or below the liquidus of the braze and solution heat-treated and aged at a temperature at which the braze and alloy mixture in the gap is solid, but the depressant diffuses away.
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