CMP slurry for planarizing metals
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United States of America Patent
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Feb 18, 2003
Issued Date -
N/A
app pub date -
Oct 19, 2000
filing date -
Oct 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A CMP slurry is formulated with an oxidizer capable of oxidizing a metal undergoing planarization and yielding a complexing agent which complexes with the oxidized metal thereby minimizing overetching. The slurry may further include abrasive particles, inhibitors, pH adjusting agents, and combinations thereof.
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