Plastic integrated circuit device package and method for making the package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 18, 2003
Issued Date -
N/A
app pub date -
Oct 31, 2000
filing date -
Oct 21, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package for an integrated circuit device, having a die, a die pad, leads, bond wire, and an encapsulant. The lower surfaces of the die pad and the leads are provided with stepped profiles. Structures extending from lateral sides of the leads are formed to prevent the leads from being pulled horizontally from the package. Encapsulant material fills beneath the recessed, substantially horizontal surfaces of the die pad and the leads, and thereby prevents the die pad and the leads from being pulled vertically from the package body. Other portions of the die pad and the leads are exposed within the package for connecting the package externally.
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