Micromachine stacked wirebonded package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 18, 2003
Grant Date -
N/A
app pub date -
Sep 26, 2000
filing date -
Sep 26, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A micromachine package includes a micromachine chip having a micromachine area in a front surface of the micromachine chip. The package further includes a controller chip having a rear surface and a front surface. Bond pads are on the front surface of the controller chip. A bead secures the rear surface of the controller chip to the front surface of the micromachine chip. By mounting the controller chip directly on the micromachine chip, the size of the package is minimized. Further, the bead and controller chip form an enclosure around the micromachine area. This enclosure protects the micromachine area from the ambient environment.
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