Intelligent binning for electrically repairable semiconductor chips and method
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United States of America Patent
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Feb 18, 2003
Issued Date -
N/A
app pub date -
Aug 30, 2001
filing date -
Aug 2, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.
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