Method for forming fine through hole conduction portion of circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 25, 2003
Grant Date -
N/A
app pub date -
Feb 28, 2001
filing date -
Jul 2, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In order to realize through hole conduction of an internal layer wiring pattern 4 and respective external layer conduction layers 2 and 5 on both sides, a through hole partially blocked is formed to the internal layer wiring pattern 4 from one external layer conduction layer 2 by laser means. Similarly, another through hole which is partially blocked and displaced from the former hole within an allowable range is formed to the internal layer wiring pattern 4 from the other external layer conduction layer 5 by the laser means, thereby forming a stepped through hole 6. At last, a through hole coating layer 7 is formed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully