Metallic building element for optoelectronics
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United States of America Patent
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Feb 25, 2003
Grant Date -
N/A
app pub date -
Aug 17, 1999
filing date -
Aug 18, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range is disclored. Starting from a silicon master or original that can be etched to sub-micrometer precision and then plated with a metal, such as nickel, on the silicon surface, there can be produced a nickel shim where precision and surface fineness can lie in the sub-micrometer range. Subsequent to removal of the silicon master, a photo-sensitive material can be used in liquid form or in film form to create mould cavities that reach down to the nickel shim. These cavities can then be metal-plated to provide a building element of higher precision in three dimensions.
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