Method of making a parallel capacitor laminate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6524352
APP PUB NO 20020054471A1
SERIAL NO

10043830

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES INCMAPLES CORPORATE SERVICES LIMITED PO BOX 309 UGLAND HOUSE GRAND CAYMAN KY1-1104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adae-Amoakoh, Sylvia Binghamton, NY 6 179
Lauffer, John M Waverly, NY 123 2396
Lowell, Michael D Endicott, NY 5 255
Markovich, Voya R Endwell, NY 198 5225
Sniezek, Joseph J Endwell, NY 4 94

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