Multilayer printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 25, 2003
Grant Date -
N/A
app pub date -
Jul 21, 1997
filing date -
Aug 5, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Multilayer printed circuit board includes a core substrate, multilayer wiring layer formed on the core substrate by alternately laminating interlaminar insulating layer and conductor circuit, and a solder pad group having two-dimensionally arranged pads having solder bumps on a surface of the multilayer wiring layer. Solder pads of the solder pad group are arranged in only a peripheral portion other than a central portion to form a frame shape. Solder pads located at an outside part of the frame shape have flat pads having surfaces which are each connected to conductor pattern on a surface of one of the interlaminar insulating layer, and have solder bumps formed on surfaces of the flat pads. Solder pads located at an inside part of the frame shape have viaholes which are each connected to an innerlayer flat pad group located in an innerlayer, and have solder bumps in recess portions of the viaholes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully