Methods of making microelectronic assemblies including compliant interfaces
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United States of America Patent
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Feb 25, 2003
Issued Date -
N/A
app pub date -
Mar 2, 2000
filing date -
Sep 20, 1994
priority date (Note) -
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Abstract
A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.
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