Substrate processing system and substrate processing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 25, 2003
Grant Date -
Dec 6, 2001
app pub date -
May 30, 2001
filing date -
May 31, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.
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