Angled flying lead wire bonding process
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United States of America Patent
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-
Mar 4, 2003
Issued Date -
N/A
app pub date -
May 31, 2001
filing date -
Oct 19, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
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