Method for fabricating a metal plated spring structure
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United States of America Patent
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-
Mar 4, 2003
Grant Date -
Nov 21, 2002
app pub date -
May 21, 2001
filing date -
May 21, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
Efficient methods are disclosed for fabricating metal plated spring structures in which the metal is plated onto the spring structure after release. A conductive release layer is deposited on a substrate and a spring metal layer is then formed thereon. A first mask is then used to form a spring metal finger, but etching is stopped before the release layer is entirely removed. A second mask is then deposited that defines a release window used to remove a portion of the release layer and release a free end of the spring metal finger. The second mask is also used to plate at least some portions of the free end of the finger and selected structures exposed through the second mask. Remaining portions of the release layer are utilized as electrodes during electroplating. The resulting spring structure includes plated metal on both upper and lower surfaces of the finger.
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