Method for fabricating an interconnect for making temporary electrical connections to semiconductor components
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United States of America Patent
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Mar 4, 2003
Issued Date -
N/A
app pub date -
Oct 9, 2001
filing date -
Aug 22, 1997
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An interconnect for making temporary electrical connections with semiconductor components includes a substrate with patterns of elastomeric contacts adapted to electrically engage contact locations (e.g., bond pads, solder bumps) on the semiconductor components. The elastomeric contacts can be formed of conductive elastomer materials, such as anisotropic adhesives and silver filled silicone, having metal particles for penetrating the contact locations. The substrate also includes patterns of metal conductors having non-oxidizing contact pads, which provide low resistance bonding surfaces for the elastomeric contacts. A method for fabricating the interconnect includes the step of depositing bumps in a required size and shape using stenciling, screen printing, or other deposition process. Following deposition, the bumps can be cured and planarized to form the elastomeric contacts. During a test procedure, the elastomeric contacts can be loaded in compression to compliantly engage the contact locations.
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